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Publications by Masahiro KATAOKA
Characteristics of Tarnish on Surfaces of Tin Plated Copper Alloys for Electrical and Electronic Purposes.
Transactions of Japan Society of Spring Engineers
Related publications
Electron Microprobe Study of the Composition of Tarnish Films on Copper-- Zinc, Copper--Aluminum, and Copper--Nickel Alloys
Electrical-Resistance Alloys of Copper, Manganese, and Aluminum
Journal of Research of the National Bureau of Standards
Tarnish Resisting Silver Alloys.
Technologic Papers of the Bureau of Standards
Effects of Chemical Composition and Sintering Temperature on Properties of Iron-Tin and Iron-Tin-Copper Sintered Alloys for Porous Bearings.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
Diffusion Coefficient of Copper, Tin and Copper Tin Alloy
EPJ Web of Conferences
Astronomy
Physics
Electrical Transport and Electronic Structure Calculation of Al-Ga Binary Alloys
Acta Physica Polonica A
Astronomy
Physics
On Some Gold-Tin Alloys
Proceedings of the Royal Society of London
Wettabilities of Liquid Tin on Solid Copper
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Selective Dissolution in Copper-Tin Alloys: Formation of Corrosion-Resistant Patina on Ancient Chinese Bronze Mirrors
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
