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Publications by Masaru SEITA

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.

Journal of the Surface Finishing Society of Japan

English

Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

English