Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Masaru SEITA
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
Journal of the Surface Finishing Society of Japan
Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Related publications
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.
Journal of the Surface Finishing Society of Japan
Special Issue/Plating on Engineering Plastics. Printed Wiring Boards.
Jitsumu Hyomen Gijutsu
Laser Drilling of Printed-Wiring Boards
Circuit Technology
Drillability of Multilayer Printed Wiring Boards.
Circuit Technology
Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. McM-L Design for RISC Workstation.
Circuit Technology
Filament Formation on Printed Wiring Boards
Multilayer Printed Wiring Board Lamination
Pattern Inspection Algorithm for Printed Wiring Boards: Radial Matching.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Automatic Inspection System for Printed Wiring Board Patterns.
The Journal of the Institute of Television Engineers of Japan
