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Publications by Matthew J. Combs
Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging
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Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
A 0D Lead‐Free Hybrid Crystal With Ultralow Thermal Conductivity
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Thermal Conductive Composites: Anisotropic Thermal Conductive Composite by the Guided Assembly of Boron Nitride Nanosheets for Flexible and Stretchable Electronics (Adv. Funct. Mater. 37/2019)
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Optimization and Characterisation of Bonding of Piezoelectric Transducers Using Anisotropic Conductive Adhesive
Printed Electronics Based on Inorganic Conductive Nanomaterials and Their Applications in Intelligent Food Packaging
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Anisotropic Thermal Conductivity in Epoxy-Bonded Magnetocaloric Composites
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Diffusion Performance of Moisture in Conductive Adhesive Interconnection Structure
Modeling the Effective Thermal Conductivity of an Anisotropic Gas Diffusion Layer in a Polymer Electrolyte Membrane Fuel Cell
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Glass Transition Temperature of Nanoparticle-Enhanced and Environmentally Stressed Conductive Adhesive Materials for Electronics Assembly
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