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Publications by Melvin P. Zussman
Electrical Reliability of Cu and Low- K Dielectric Integration
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Low-K/Cu Integration Consistent From 90nm Thru 32nm (Invited)
Characterization of Al, Cu, and TiN Surface Cleaning Following a Low-K Dielectric Etch
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Nanoindentation of Silicate Low-K Dielectric Thin Films
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Metal Drift Induced Electrical Instability of Porous Low Dielectric Constant Film
Journal of Applied Physics
Astronomy
Physics
Electrical Characteristics and Reliability Properties of Metal-Oxide-Semiconductor Field-Effect Transistors With La2O3 Gate Dielectric
Journal of Applied Physics
Astronomy
Physics
Water Diffusion and Fracture Behavior in Nanoporous Low-K Dielectric Film Stacks
Journal of Applied Physics
Astronomy
Physics
Electrical Actuation of Dielectric Droplets
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects
Constraint Effects on Cohesive Failures in Low-K Dielectric Thin Films
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
