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Publications by Michal Prach
Research of Interaction Between Zn Based Solders and Cu, Al Substrates
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS
Acta Polytechnica
Engineering
Related publications
Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
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Simultaneous Increase in Strength and Ductility by Decreasing Interface Energy Between Zn and Al Phases in Cast Al-Zn-Cu Alloy
Scientific Reports
Multidisciplinary
Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fatigue Crack Behavior on a Cu-Zn-Al SMA
Frattura ed Integrita Strutturale
Mechanics of Materials
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Influences of Fe, Si and Cu on Al-Zn-Mg Alloy
The Journal of the Japan Institute of Metals.B
Thermal Interactions Between the Y-Ba-Cu-O Based Superconductors and ZrO2 Substrates
Epitoanyag - Journal of Silicate Based and Composite Materials
Thermoelastic Properties on Cu-Zn-Al Shape Memory Springs
Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Reaction Between Fe-Zn Alloy Layer and Zn-Al Melt.
Journal of the Surface Finishing Society of Japan
Any Old Fe2, Cu, Al, Pb, Zn, Glass, Paper…?
Nature
Multidisciplinary
