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Publications by Min-Hui Huang

Material Characterization and Failure Analysis for Microelectronics Assembly Processes

English

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X-Ray Spectral Imaging in the STEM for Microelectronics Failure Analysis

Microscopy and Microanalysis

Instrumentation

English

Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics

Facta universitatis - series: Electronics and Energetics

English

CuAAC-Based Assembly and Characterization of a New Molecular Dyad for Single Material Organic Solar Cell

Materials Science

English

Development of Simulator for a Material Handling System Analysis of Assembly Line

International Journal of Computer Theory and Engineering

English

Material Analysis in Fast Industrial Processes by LIBS

English

Multiscale Transient Thermal Analysis of Microelectronics

Journal of Electronic Packaging, Transactions of the ASME

Mechanics of Materials

Electronic Engineering

Computer Science Applications

Magnetic Materials

English

Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing

Journal of Manufacturing Science and Engineering, Transactions of the ASME

Systems Engineering

Mechanical Engineering

Manufacturing Engineering

Computer Science Applications

English

Novel Luminescent Material and Processes for Optical Devices

English

Heavy-Ion Beam Analysis Applied to Surface Characterization for Material Study.

English