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Publications by Moritoshi ANDO
Pattern Inspection Algorithm for Printed Wiring Boards: Radial Matching.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Basic Science Series. (8). Software Technologies of AOI.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
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The Journal of the Institute of Television Engineers of Japan
Design of Thermal Expansion Coefficient for Multilayer Printed Wiring Boards.
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Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. McM-L Design for RISC Workstation.
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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.
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Environment-Friendry Printed Wiring Boards (PWB) and the Technologies for Their Inflammabilities
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