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Publications by Motoyo WAJIMA
Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer.
Circuit Technology
Related publications
Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards From the View Point of Electronic Design.
Circuit Technology
Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. McM-L Design for RISC Workstation.
Circuit Technology
Allylated Polyphenylene Ether for Low Dielectric Printed Circuit Boards.
Circuit Technology
Drillability of Multilayer Printed Wiring Boards.
Circuit Technology
High-Speed Micro Drilling on Printed Circuit Boards
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Application of Eddy-Current Testing Technique for High-Density Double-Layer Printed Circuit Board Inspection
IEEE Transactions on Magnetics
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.
Journal of the Surface Finishing Society of Japan
Ecology Treatment of Printed Circuit Boards
Acta Mechanica Slovaca
Blind via Hole in Multi-Layer AFRP Printed Wiring Boards by Build-Up Process
JSME International Journal Series A
