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Publications by Nobuhiro KANAMARU

Electrodeposition of Copper From the Bath of Aminoacid Complex Salts

Journal of the Metal Finishing Society of Japan
1969English

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Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.

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Electrodeposition of Copper From Ethylenediamine Complex Solution and Properties of Deposit.

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Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath III. Effect of Cl- Ions

Denki Kagaku oyobi Kogyo Butsuri Kagaku
1983English

Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath I. The Behavior of Intermediate, Cu+

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Electrodeposition of Nickel From Ni(CF3COO)2-Hconh2 Bath

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Mechanism of Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath II. Mixed Controlled Reaction Model

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Electrodeposition of Crystalline HgTe From a Non-Aqueous Plating Bath

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Electrodeposition of Au-Sn Alloy From a Sulfite-Pyrophosphate Bath

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Electrodeposition of Ag Film From Ammoniacal AgNO3 Bath Containing Polyethyleneimine

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