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Publications by Nobuo IWASE
EMC of Semiconductor Packages. Thermal Performance and EMC of Semiconductor Packages.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Improvement on Leakage Current Performance of Semiconductor IC Packages by Eliminating ESD Events
Asian Journal of Engineering and Technology
Effect of Au Thickness on Laser Beam Penetration in Semiconductor Laser Packages
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
EMC of Portable Electronic Products. EMC Design for Video Camera.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
High Speed/High Frequency Technology and EMC. EMC for High-Speed/High-Frequency Communications. EMC Technology for Mobile Communications.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Improving Thermal Performance of Radioactive Material Drum Type Packages by Using Heat Pipes
Codestrate Packages
High Speed/High Frequency Technology and EMC. EMC for High-Speed/High-Frequency Communications. High Speed Technology and EMC in Satellite Communication.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Experiments and Demonstrations at EMC+SIPI 2017
IEEE Electromagnetic Compatibility Magazine
Instrumentation
Signal Processing
Electronic Engineering
Computer Networks
Communications
Electrical
Software
Design of Products in Electrical Fire Monitoring System for EMC Performance
DEStech Transactions on Engineering and Technology Research
