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Publications by Nobuto Terada

Laser Sintering Technology for Printed Electronics: Minute Wiring and Functional Coating With Ag-Nanoparticle Paste

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

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Laser Drilling of Printed-Wiring Boards

Circuit Technology

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Intense Pulsed Light Sintering of Copper Nanoink for Printed Electronics

Applied Physics A: Materials Science and Processing

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.

Journal of the Surface Finishing Society of Japan

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Microwave Sintering of Ag-Nanoparticle Thin Films on a Polyimide Substrate

English

Synthesis With Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging

Materials Transactions

Mechanics of Materials

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Condensed Matter Physics

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Pulsed Laser Annealing of Ag-Paste on N-Doped Emitter

Jurnal Kejuruteraan

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Multilayer Printed Wiring Board Lamination

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Automatic Inspection System for Printed Wiring Board Patterns.

The Journal of the Institute of Television Engineers of Japan

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Filament Formation on Printed Wiring Boards

English