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Publications by Norihisa Sekimori
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating With Those Produced by Autocatalytic Electroless Gold Plating
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fatigue Characteristics of Lead-Free Solder Alloys.
Materia Japan
Concurrent Electromigration and Creep in Lead-Free Solder
Journal of Applied Physics
Astronomy
Physics
Recent Situation of Lead-Free Solder Technology
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Measurement of Erosion of Stainless Steel by Molten Lead-Free Solder Using Micro-Focus X-Ray CT System
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Journal of Welding and Joining
