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Publications by Osamu Kamiya
Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Magnetic Susceptibility of HCP Ζ-Phase Alloys in Ag–In, Ag–Sn, Au–In, and Au–Sn Systems
Transactions of the Japan Institute of Metals
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Microstructure and Corrosion Resistance of Ti–Zr–Cu–Pd–Sn Glassy and Nanocrystalline Alloys
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Solidification Behaviour of Rapidly Quenched Cu–Sn Alloys
Materials Transactions, JIM
Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Autoradiography of Fe–As and Fe–Sn Dilute Alloys I. Calculation of Intensity Profile
Transactions of the Japan Institute of Metals
Activities of Oxygen in Liquid Cu–In and Cu–Sn Alloys Determined by a Modified Coulometric Titration Method
Transactions of the Japan Institute of Metals
