Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by P.M. Sargent
Process Variables in the Reflow Soldering of Surface Mount
Related publications
Optimisation of Reflow Profile of Surface Mount Assembly Using Taguchi Design of Experiments
Science Research
Evaluation Technique for Heat Resistance of Epoxy Woven Glass Fabric Copper-Clad Laminates in Reflow Soldering Process.
Circuit Technology
The Ontology Based FMEA of Lead Free Soldering Process
Optimization of Analytical Methods Using Response Surface Methodology - Part I: Process Variables
Revista Virtual de Quimica
Mathematics
Chemistry
Control of the Induction Soldering on the Basis of Process Temperature Indirect Measurements
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Soldering Technology. Soldering Methods and Equipments.
Circuit Technology
Optimisation for Surface Mount Placement Machines
Low Temperature Effects: Surface Mount Capacitors
Surface Mount Technology Fine Pitch BGA.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
