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Publications by Paul W. Juodawlkis
Uniformity Study of Wafer-Scale InP-to-silicon Hybrid Integration
Applied Physics A: Materials Science and Processing
Materials Science
Chemistry
Related publications
Wafer Scale Integration.
HYBRIDS
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Toward Human-Scale Brain Computing Using 3D Wafer Scale Integration
ACM Journal on Emerging Technologies in Computing Systems
Electronic Engineering
Nanoscience
Hardware
Electrical
Architecture
Nanotechnology
Software
Thermal Uniformity of 12-In Silicon Wafer During Rapid Thermal Processing by Inverse Heat Transfer Method
IEEE Transactions on Semiconductor Manufacturing
Electronic Engineering
Industrial
Condensed Matter Physics
Manufacturing Engineering
Optical
Electrical
Magnetic Materials
Electronic
Hybrid Top-Down and Bottom-Up Fabrication Approach for Wafer-Scale Plasmonic Nanoplatforms
Small
Materials Science
Nanoscience
Engineering
Biomaterials
Medicine
Biotechnology
Nanotechnology
Chemistry
Large-Scale Integration of Multidimensional Quantum Photonics Circuits on Silicon
Wafer-Scale Monolithic Integration of Al^2O^3:Er^3+Amplifiers With Si Waveguides
Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam
Transactions of the Korean Society of Mechanical Engineers, A
Mechanical Engineering
Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
Astronomy
Physics
