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Publications by QingKe Zhang
Improving Tensile and Fatigue Properties of Sn–58Bi/Cu Solder Joints Through Alloying Substrate
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints With Cu and Au Metallization
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Microstructural Evolution of Eutectic Au-Sn Solder Joints
Suppression of Cu 6 Sn 5 in TiO 2 Reinforced Solder Joints After Multiple Reflow Cycles
Materials and Design
Mechanics of Materials
Materials Science
Mechanical Engineering
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
