Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by R. A. Rummel
Bismuth in Copper Grain Boundaries
JOM
Materials Science
Engineering
Related publications
Interatomic Forces and Atomic Structure of Grain Boundaries in Copper-Bismuth Alloys
Physical Review B
Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries
Physical Review Letters
Astronomy
Physics
Statistical Evaluation of Grain Boundaries of Varistors With Modified Bismuth Oxide
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Formation of Recrystallized Grains at Grain Boundaries of Copper Bicrystals Deformed in Tension
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Evolution of Grain Boundaries
Mathematical Models and Methods in Applied Sciences
Modeling
Applied Mathematics
Simulation
Diffusion Mechanisms in Cu Grain Boundaries
Physical Review B
Revealing Prior-Austenite Grain Boundaries
Microscopy and Microanalysis
Instrumentation
Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal Under Tensile and Shear Deformation
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Grain Boundaries in the Swift–Hohenberg Equation
European Journal of Applied Mathematics
Applied Mathematics
