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Publications by R. Tuominen

IMB Technology for Embedded Active and Passive Components in SiP, SiB and Single IC Package Applications

Transactions of The Japan Institute of Electronics Packaging

English

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Active and Passive Components for Optical Networks

Optical Engineering

Molecular Physics,

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Comparison of Health-Related Components in Active and Passive Smokers

Turkish Thoracic Journal

Respiratory Medicine

English

Passive and Active Tension in Single Cardiac Myofibrils

Biophysical Journal

English

Life Cycle Costing for IC Package

Journal of Life Cycle Assessment, Japan

English

Interlayer Dielectrics for IC Package Substrate

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Smart Foam for Applications in Passive–active Noise Radiation Control

Journal of the Acoustical Society of America

English

Multi-Core/Multi-Ip Technology for Embedded Applications

IEICE Transactions on Electronics

Electronic Engineering

Magnetic Materials

English

Session Initiation Protocol (SIP) INFO Method and Package Framework

English

Challenges in Testing Embedded Passive and Active Devices Without ^|^ldquo;Visible, Reachable^|^rdquo; Access

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English