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Publications by Ratchatee Techapiesancharoenkij
Microstructural and Diffusion Analysis of Au-Sn Diffusion Couple Layer Undergoing Heat Treatment at Near Eutectic Temperatures
Engineering Journal
Engineering
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Kinetics of Reactive Diffusion in the (Sn–Cu)/Ni System at Solid-State Temperatures
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Simulations About the Effect of Heat Treatment Temperatures on the Properties of Diffusion Bonded Mg/Al Joints
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Cu-Sn Alloy Metallization of Polymer Substrate Through Reduction-Diffusion Method Using Ionic Liquid Bath at Medium-Low Temperatures
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Diffusion Welding of Alumina and Al-Sn Alloy.
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Formation of the ‘Coating—Substrate’ Transient Diffusion Layer at Electrocrystallization
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