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Publications by Robert H. Reuss
Microelectronics Packaging and Integration
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
Related publications
Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics
Facta universitatis - series: Electronics and Energetics
Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers.
Circuit Technology
Three-Dimensional–Printed Laboratory-On-A-Chip With Microelectronics and Silicon Integration
Point of Care
Nursing
Microelectronics Processing
Advances in Chemistry
Semiconductor Microelectronics and Nanoelectronics Programs
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2011
Microsystem Technologies
Electronic Engineering
Condensed Matter Physics
Nanoscience
Hardware
Optical
Electrical
Architecture
Magnetic Materials
Nanotechnology
Electronic
Molecular Biology Meets Microelectronics
Nature Biotechnology
Applied Microbiology
Biotechnology
Biomedical Engineering
Molecular Medicine
Bioengineering
