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Publications by Ryu MINAGI
Evaluation of Blind via Hole Quality on Multi-Layer Printed Wiring Boards by Cu Direct Laser Drilling
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Blind via Hole in Multi-Layer AFRP Printed Wiring Boards by Build-Up Process
JSME International Journal Series A
Laser Drilling of Printed-Wiring Boards
Circuit Technology
Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. McM-L Design for RISC Workstation.
Circuit Technology
Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards
Transactions of The Japan Institute of Electronics Packaging
Filament Formation on Printed Wiring Boards
Drillability of Multilayer Printed Wiring Boards.
Circuit Technology
Special Issue/Plating on Engineering Plastics. Printed Wiring Boards.
Jitsumu Hyomen Gijutsu
High-Speed Micro Drilling on Printed Circuit Boards
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer.
Circuit Technology
