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Publications by S. H. MANNAN
Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
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Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
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Coulostatic Monitoring the Deposition Rate of Electroless Nickel Plating.
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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
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