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Publications by S. Pinel
Thermal Modeling and Management in Ultrathin Chip Stack Technology
IEEE Transactions on Components and Packaging Technologies
System-On-Package (SOP) Architectures for Compact and Low Cost RF Front-End Modules
Related publications
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
Thermal Management of On-Chip Caches Through Power Density Minimization
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hardware
Electronic Engineering
Electrical
Architecture
Software
Emulation-Based Transient Thermal Modeling of 2d/3d Systems-On-Chip With Active Cooling
Microelectronics Journal
Negative Thermal Expansion in Ultrathin Plasma Polymerized Films
Chip-Level Statistical Leakage Modeling and Analysis
Temperature-Dependent Thermal Conductivity and Suppressed Lorenz Number in Ultrathin Gold Nanowires
Physical Review B
Optical
Electronic
Condensed Matter Physics
Magnetic Materials
Erratum To: Active Thermal Management of On-Chip Hot Spots Using EWOD-driven Droplet Microfluidics
Experiments in Fluids
Mechanics of Materials
Fluid Flow
Transfer Processes
Computational Mechanics
Astronomy
Physics
Research of Piezoelectric Stack Pump and Hybrid Precision Stepper Drive Technology
Thermal Analysis in Foundry Technology
Journal of Thermal Analysis and Calorimetry
Theoretical Chemistry
Condensed Matter Physics
Physical
