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Publications by S.N. Alam
Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Microstructural Evolution of Eutectic Au-Sn Solder Joints
Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Micro-Scale Y Addition on the Fracture Properties of Al–Cu–Mn Alloy
Chinese Journal of Mechanical Engineering (English Edition)
Industrial
Mechanical Engineering
Manufacturing Engineering
Effect of Sn Addition in the Microstructure Refinement and Corrosion Resistance of Cu-Zr-Al-Ag Alloy
Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Effects of Small Metal Additions (Co,Cu,Ga,Mn,Al,Bi,Sn) on the Magnetocaloric Properties of the Gd5Ge2Si2 Alloy
Journal of Applied Physics
Astronomy
Physics
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
