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Publications by S.N. Burchett

Stresses From Flip-Chip Assembly and Underfill; Measurements With the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method

English

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Solder Paste Reflow Modeling for Flip Chip Assembly

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High Accuracy Die Mechanical Stress Measurement With the ATC04 Assembly Test Chip

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RIOT -- A Simple Graphical Chip Assembly Tool

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Finite Element Chip Formation Analysis for High Speed Milling Operations

Transactions of the Canadian Society for Mechanical Engineering

Mechanical Engineering

English

Inspection of Flip-Chip Epoxy Underfill in Microelectronic Assemblies Using Compensated Laser-Based Ultrasonic Receivers

English

Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages

Journal of Light and Visual Environment

Electronic Engineering

English

Millimeter-Wave Flip-Chip IC Module.

English