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Publications by Sachio Yoshihara
Influence of Crystallographic Structure on Etching Rate of Copper by Using Ammonium Peroxodisulfate Solution
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Additive Effects on the Etching of Copper Using Sulfuric Acid / Hydrogen Peroxide Solution
Journal of The Surface Finishing Society of Japan
Copper Sulfite and Copper Ammonium Sulfites Formed by the Reaction Between Copper Sulfate and Ammonium Sulfite Solution
The Journal of the Society of Chemical Industry, Japan
Study on Etching Characteristics of Contacting Copper and Other Metals by Sulfuric Acid Solution Containing Thiourea
Journal of The Surface Finishing Society of Japan
New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.
Circuit Technology
The Influence of Exchange Rate Movements on World Copper Supply.
Influence of Etching Products on Enlargement of Surface Area During AC Etching of High-Purity Aluminum Foil in Hydrochloric Acid Solution.
Journal of the Surface Finishing Society of Japan
The Solution Rate of Solid Iron in Liquid Copper
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Preferential Dissolution Behavior of Copper-Nickel Alloys in Neutral Ammonium Acetate Solution
Zairyo to Kankyo/ Corrosion Engineering
Surfaces
Alloys
Metals
Materials Chemistry
Electrochemistry
Films
Coatings
The Granulation of Compound Fertilizer Using Ammonium Carbonate Solution.
The Journal of the Society of Chemical Industry, Japan
