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Publications by Salman Shafqat
Investigation of “Fur-Like” Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
Materials Science in Semiconductor Processing
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching
IEEE Transactions on Nanotechnology
Electronic Engineering
Nanotechnology
Computer Science Applications
Electrical
Nanoscience
Fabrication of Superhydrophobic Micro Post Array on Aluminum Substrates Using Mask Electrochemical Machining
Chinese Journal of Mechanical Engineering (English Edition)
Industrial
Mechanical Engineering
Manufacturing Engineering
Etching Technologies of Silicon Wafer Using Dry Process
Journal of The Surface Finishing Society of Japan
Etch Pit Growth Behavior During DC Etching.
Journal of the Surface Finishing Society of Japan
Etch Characteristics of Nickel Oxide Thin Films Using Inductively Coupled Plasma Reactive Ion Etching
Electrochemical and Solid-State Letters
A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2and SF6/O2
Advances in Materials Science and Engineering
Materials Science
Engineering
(Invited) Towards a Vertical and Damage Free Post-Etch InGaAs Fin Profile: Dry Etch Processing, Sidewall Damage Assessment and Mitigation Options
ECS Transactions
Engineering
Application of Photosensitive Polyimide: Mask Saving Process for Buffer Coating.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Extremely High Selective Etching of Porous Si for Single Etch-Stop Bond-And-Etch-Back SOI
