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Publications by Sangshik Kim
Increasing Strength and Conductivity of Cu Alloy Through Abnormal Plastic Deformation of an Intermetallic Compound
Scientific Reports
Multidisciplinary
Effects of Exposure Temperature on Tensile and Charpy Impact Properties of the 7xxx Aluminum Alloy for Aerospace Applications
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Related publications
Microstructure of a High Strength AZ91 Alloy Processed by Severe Plastic Deformation
Microscopy and Microanalysis
Instrumentation
Effect of Plastic Deformation on the Proof Strength and Electrical Conductivity of Copper-Magnesium Supersaturated Solid-Solution Alloys
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Plastic Deformation and Martensitic Transformation of Γ-Fe Particles in a Cu–Fe Alloy Single Crystal
Transactions of the Japan Institute of Metals
Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Hot Forming Hollow Products From High Strength Aluminum Alloy With Required Treatment of Metal Structure by Plastic Deformation
Mechanics and Advanced Technologies
Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient
Scientific Reports
Multidisciplinary
Acoustic Emission Generated During Tensile Deformation of Cu-Co Alloy
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
An Analytical Framework for Modelling Intermetallic Compound (IMC) Formation and Optimising Bond Strength in Aluminium‐steel Welds
Material Design & Processing Communications
