Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Satoshi OGAWA
Development of Low-Temperature Type Electroless Nickel Plating Bath Containing Hypophosphite as a Reducing Agent.
Journal of the Surface Finishing Society of Japan
Related publications
Electroless Nickel Plating on the Fine Pattern Using Mixed Plating Bath Containing Hydrazine and Hypophosphite
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Electroless Plating of Cobalt Containing Tungsten Using Hydrazine as a Reducing Agent
Journal of The Surface Finishing Society of Japan
Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.
Journal of the Surface Finishing Society of Japan
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
Engineering
Stability of Passivation Film on Stainless Steel in a Nickel Electroless Plating Bath.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.
Journal of the Surface Finishing Society of Japan
Application of Precision Filtration on Electroless Copper Plating Bath.
Journal of the Surface Finishing Society of Japan
Amorphous Like Ni-B Alloy Prepared by Electroless Plating Method Using Dimethylamine Borane as Reducing Agent
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Laser-Enhanced Electroless Nickel Plating on Polyimide Film.
Journal of the Surface Finishing Society of Japan