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Publications by Satoshi Shimoyama
Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints
Transactions of The Japan Institute of Electronics Packaging
Related publications
Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints With Co-P Plating a Using Ball Impact Test
Transactions of The Japan Institute of Electronics Packaging
Deformation Evaluation of Solder Ball Joints by Electromotive Force
Applied Mechanics and Materials
The Wettability of the Molten Sn-3Ag-0.5Cu and Sn-9Zn Solder Drops on the Copper Plate in the Low Oxygen Atmosphere
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Journal of Welding and Joining
Effect of TiO2 Nanoparticles on the Horizontal Hardness Properties of Sn-3.0Ag-0.5Cu-1.0TiO2 Composite Solder
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
Engineering
Computer Science Applications
Process Chemistry
Transfer Processes
Technology
The Effect of Brazing Temperature on Shear Strength of Nickel Based Superalloy (Inconel 738LC) Joints
Acta Physica Polonica A
Astronomy
Physics
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
