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Publications by Seiki TAKAHASHI
Evaluation of Subsurface Damage in Silicon Wafer Based on Deflection Analysis
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
General Survey on the Religious Psychology of Children
Japanese Journal of Educational Psychology
Developmental
Education
Educational Psychology
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Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam
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Influence of Sampling Interval on Deflection-Influence-Line-Based Damage Detection in Beams
Journal of Applied Engineering Science
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Structural Engineering
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Quality
the Environment
Methanol Steam Reformer on a Silicon Wafer
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Influence of Silicon Wafer Crystallographic Orientation on Anodization Mechanism
Doklady BGUIR
Mechanical Properties of Silicon in Subsurface Damage Layer From Nano-Grinding Studied by Atomistic Simulation
AIP Advances
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Reduction of Thermal Conductivity in Wafer-Bonded Silicon
Applied Physics Letters
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Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
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Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
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Physics