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Publications by Seong-Min Lee
Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers With Different Thicknesses
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Related publications
Local Quasioptical Resonator Diagnostics of Semiconductor Wafers
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
The Effect of Microstructure, Thickness Variation, and Crack on the Natural Frequency of Solar Silicon Wafers
Journal of Solar Energy Engineering, Transactions of the ASME
Renewable Energy
Power Technology
the Environment
Sustainability
Energy Engineering
Stability of Dolosse With Different Waist Thicknesses for Irregular Waves
Effect of Different Wall Thicknesses on Fracture Strength, Marginal Accuracy and Translucency of Monolithic Ceramic Restorations
Al-Azhar Dental Journal for Girls
Fracture Behaviors of Monolithic Lithium Disilicate Ceramic Crowns With Different Thicknesses
RSC Advances
Chemistry
Chemical Engineering
Table 3: Results of FEA on Sanagasta Egg Models With Different Eggshell Thicknesses.
Effect of Ultrasonic Strain on P-Type Silicon Wafers
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Surface Damage Effects in Ultrasonic Cleaning of Silicon Wafers
Fracture Behavior of Glass/Resin/Glass Sandwich Structures With Different Resin Thicknesses
Transactions of the Korean Society of Mechanical Engineers, A
Mechanical Engineering
