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Publications by SeungJin Oh
High-Aspect-Ratio Copper via Filling Used for Three-Dimensional Chip Stacking
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Related publications
Novel Pressure-Sensitive Bonding Tape in the Three-Dimensional Chip Stacking
Journal of The Adhesion Society of Japan
High-Aspect Ratio Β-Ga2O3 Nanorods via Hydrothermal Synthesis
Nanomaterials
Materials Science
Chemical Engineering
Natural Convection in High Aspect Ratio Three-Dimensional Enclosures With Uniform Heat Flux on the Heated Wall
Revista de Engenharia Térmica
Study on the Mechanism and Modeling for Super-Filling of High-Aspect-Ratio Features With Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled With Plasma Treatment
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Filling of Three-Dimensional Space by Two-Dimensional Sheet Growth
Physical Review E
Mapping Three-Dimensional Temperature in Microfluidic Chip
Scientific Reports
Multidisciplinary
High-Resolution Liquid Patterns via Three-Dimensional Droplet Shape Control
Nature Communications
Astronomy
Genetics
Molecular Biology
Biochemistry
Chemistry
Physics
High-Aspect-Ratio Semiconducting Polymer Pillars for 3D Cell Cultures
Flutter Suppression for High Aspect Ratio Flexible Wings Using Microflaps
