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Publications by Shang-Jie Jiang

The Technology and Application of Shrink Packaging

English

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Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.

Circuit Technology

English

SLC/FCA Packaging Technology.

English

The Current Technology of GaAs MMIC Packaging.

English

The Activity of “Electronics Packaging Technology Symposium”

English

Packaging Technology of SiC Power Electronics

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Editorial for Journal of Packaging Technology and Research

Journal of Packaging Technology and Research

English

Editorial for Journal of Packaging Technology and Research

Journal of Packaging Technology and Research

English

Genomes on the Shrink

Proceedings of the National Academy of Sciences of the United States of America

Multidisciplinary

English

Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.

Journal of the Surface Finishing Society of Japan

English