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Publications by Shinichi Fujiwara
Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate
Journal of Polytechnic
Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate
Chinese Science Bulletin
Improvement of Cu-Pillar Structure Using Advanced Plating Method
Journal of Materials Science and Engineering B
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
ELECTRODEPOSITION OF (Cu-Sn)1/(Cu-Sn)2 MULTILAYER COATINGS FROM PYROPHOSPHATE-TRILONATE ELECTROLYTE
Scientific notes of Taurida National V.I. Vernadsky University. Series: Technical Sciences
Pb-Sn-Cu Alloy Plating From Fluoborate Baths by Pulse and Constant-Current Methods.
Journal of the Metal Finishing Society of Japan
Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Studies on Corrosion Products of Fe-Cu-Sb, Fe-Cu-Se, Fe-Cu-Sn and Fe-Cu-As Alloy Systems in Sulfuric Acid
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
