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Publications by Shinji ISHIKAWA
Formation of Kirkendall Voids in the Reactive Diffusion Between Cu Plate and Lead-Rich Solders
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Kirkendall-Like Voids Produced by Surface Diffusion
Microscopy and Microanalysis
Instrumentation
Cu Corrosion Test Method for Lead-Free Solders
Journal of Welding and Joining
Evaluation of Interdiffusion in Liquid Phase During Reactive Diffusion Between Cu and Al
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Research of Interaction Between Zn Based Solders and Cu, Al Substrates
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters
Journal of Materials Engineering and Performance
Mechanics of Materials
Materials Science
Mechanical Engineering
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
