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Publications by Shinya Takata
Bondability of Copper Joints Formed Using a Mixed Paste of Ag2O and CuO for Low-Temperature Sinter Bonding
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Joining of Pure Copper Using Cu Nanoparticles Derived From CuO Paste
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Low-Temperature Bonding of Copper Pillars for All-Copper Chip-To-Substrate Interconnections
Electrochemical and Solid-State Letters
Effect of Shielding Gases on Ball Forming and Bondability in Copper Wire Bonding
Journal of Smart Processing
Shear Strength of Cu-To-Cu Joints Using Mixed Ag Particle Paste
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Low Temperature Bonding for 3D Integration-Surface Activated Bonding (SAB)
Hyomen Kagaku
Interfacial Microstructure and Thermal Stability of Zr55Cu30Ni5Al10 Metallic Glass Joints Formed by Ultrasonic Bonding
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Low Temperature Bonding of Cu on Si3N4 Using Laser Ablation Process
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Tailoring the Reducibility and Catalytic Activity of CuO Nanoparticles for Low Temperature CO Oxidation
RSC Advances
Chemistry
Chemical Engineering
Low Resistivity Contacts to Superconducting Oxide Using Ag2O Powder.
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
