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Publications by Shohei Hata
Development of the Low Melting Point Sn-Based Thin Film Solder Possible to Join With Fluxless
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Change in Fatigue Properties of Silicon Nitride Ceramics and Metal Joints With Thermal Cycling
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Related publications
Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Progress on Sn-Based Thin-Film Anode Materials for Lithium-Ion Batteries
Chinese Science Bulletin
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Development of Thin Film Diamond Based Integrated Circuit Technology.
Memristive Characteristic of an Amorphous Ga-Sn-O Thin-Film Device
Scientific Reports
Multidisciplinary
Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications
The Wettability of the Molten Sn-3Ag-0.5Cu and Sn-9Zn Solder Drops on the Copper Plate in the Low Oxygen Atmosphere
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Development of Thin-Film Pyrotechnic Resistors
Synthesis of Furan Dimer-Based Polyamides With a High Melting Point
Journal of Polymer Science, Part A: Polymer Chemistry
Organic Chemistry
Polymers
Materials Chemistry
Plastics
