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Publications by Shouxu Wang
Erratum To: Effect of the Different Shapes of Silver Particles in Conductive Ink on Electrical Performance and Microstructure of the Conductive Tracks
Journal of Materials Science: Materials in Electronics
Electronic Engineering
Biomedical Engineering
Condensed Matter Physics
Biomaterials
Electronic
Molecular Physics,
Biophysics
Optical
Electrical
Atomic
Magnetic Materials
Bioengineering
Optics
Related publications
Novel Conductive Nano-Composite Ink Based on Poly Aniline, Silver Nanoparticles and Nitrocellulose
Egyptian Journal of Chemistry
Direct Printing and Electrical Characterization of Conductive Micro-Silver Tracks by Alternating Current-Pulse Modulated Electrohydrodynamic Jet Printing
Journal of Manufacturing Science and Engineering, Transactions of the ASME
Control
Systems Engineering
Industrial
Mechanical Engineering
Manufacturing Engineering
Computer Science Applications
Rapid Fabrication and Characterization of PDMS Microfluidics Device Using Printed Conductive Silver Ink
Materials Today: Proceedings
Materials Science
Research on Applying Conductive Ink in Electric- Heating
Effect of Properties of Conductive Ink on Printability of Electrode Patterning by Gravure Printing Method
Journal of the Korean Society for Precision Engineering
Industrial
Risk
Mechanical Engineering
Manufacturing Engineering
Reliability
Safety
Quality
Effects of Silver Coating Covered With Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Electrical Losses in the Sections of the Split Conductive Crucible
The Effect of Conductive Fragments on Electrorheological Properties
Nihon Reoroji Gakkaishi
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Synthesis of a Nano-Silver Metal Ink for Use in Thick Conductive Film Fabrication Applied on a Semiconductor Package
PLoS ONE
Multidisciplinary
