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Publications by Shozo MIZUMOTO
Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.
Journal of the Surface Finishing Society of Japan
Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.
Journal of the Surface Finishing Society of Japan
Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.
Journal of the Metal Finishing Society of Japan
Preliminary Study on Electroplating by Vibration Method
Journal of the Metal Finishing Society of Japan
Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.
Journal of the Surface Finishing Society of Japan
Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy.
Journal of the Surface Finishing Society of Japan
Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Iron Plating From Sulfate Baths
Journal of the Metal Finishing Society of Japan
In Situ Monitoring of Electroless Nickel-Phosphorous Alloy Plating Baths by Fourier Transform Infrared Attenuated Total Reflectance(FTIR ATR) Spectrometry.
Journal of the Surface Finishing Society of Japan
Electrodeposition of Copper From Ethylenediamine Complex Solution and Properties of Deposit.
Journal of the Surface Finishing Society of Japan
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