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Publications by Shumeng Dang
Research on the Thermal Conductivity and Dielectric Properties of AlN and BN Co-Filled Addition-Cure Liquid Silicone Rubber Composites
RSC Advances
Chemistry
Chemical Engineering
Related publications
Effect of BN Addition on the Mechanical Properties of AlN
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Thermal Conductivity and Impact Properties of Iron Ore Tailings Filled Epoxy Composites
Nigerian Journal of Technology
Effect of Carbon Fibers on Thermal Properties and Mechanical Strength of Ceramizable Composites Based on Silicone Rubber
Journal of Thermal Analysis and Calorimetry
Theoretical Chemistry
Condensed Matter Physics
Physical
Effects of Alkanolamide Addition on Cure Characteristics, Crosslink Density and Tensile Properties of Carbon-Black-Filled Styrene-Butadiene Rubber Compounds
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
"An Experimental and Computational Study on Thermal Conductivity of Marble Particle Filled Epoxy Composites"
Rasayan Journal of Chemistry
Pharmacology
Biochemistry
Energy
Chemical Engineering
Toxicology
Chemistry
Pharmaceutics
Rheological Properties and Thermal Conductivity of AlN–poly(propylene Glycol) Suspensions
Heat and Mass Transfer/Waerme- und Stoffuebertragung
Transfer Processes
Fluid Flow
Condensed Matter Physics
Thermal and Electrical Conductivity of Unsaturated Polyester Resin Filled With Copper Filler Composites
International Journal of Polymer Science
Polymers
Plastics
Improving Heat Ageing and Thermal Properties of Silicone Rubber Using Montmorillonite Clay
Journal of Applied Polymer Science
Surfaces
Plastics
Polymers
Materials Chemistry
Films
Coatings
Chemistry
Preparation of Novel xGNPs/SBS Composites With Enhanced Dielectric Constant and Thermal Conductivity
Advances in Polymer Technology
Organic Chemistry
Polymers
Plastics
Chemical Engineering
