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Publications by Sigeo SHIOTA
Design of Thermal Expansion Coefficient for Multilayer Printed Wiring Boards.
Circuit Technology
Related publications
Drillability of Multilayer Printed Wiring Boards.
Circuit Technology
Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. McM-L Design for RISC Workstation.
Circuit Technology
Laser Drilling of Printed-Wiring Boards
Circuit Technology
Multilayer Printed Wiring Board Lamination
Filament Formation on Printed Wiring Boards
Pattern Inspection Algorithm for Printed Wiring Boards: Radial Matching.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.
Journal of the Surface Finishing Society of Japan
Special Issue/Plating on Engineering Plastics. Printed Wiring Boards.
Jitsumu Hyomen Gijutsu
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
Journal of the Surface Finishing Society of Japan
