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Publications by Simon Althoff
Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
International Symposium on Microelectronics
Related publications
Design of Multi-Functional Ultrasonic Imaging Logging Tool
Design Challenges for New Application Specific Processors
IEEE Design & Test of Computers
Wedge Transducer Design for Two-Dimensional Ultrasonic Manipulation in a Microfluidic Chip
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Challenges With Multi-Dimensional Inventory Classifications and Optimization
Asian Social Science
Arts
Finance
Humanities
Economics
Econometrics
Social Sciences
Generative Computer-Aided Design: New Design Tool for Direct Physical Production
Ultrasonic Aluminum Wire Bonding. Final Report
Design Droughts: A New Planning Tool for Ecosystem Rehabilitation
International Journal of GEOMATE
Building
Geotechnical Engineering
Soil Science
Engineering Geology
Construction
Environmental Engineering
PathVisio-Faceted Search: An Exploration Tool for Multi-Dimensional Navigation of Large Pathways
Bioinformatics
Statistics
Probability
Molecular Biology
Biochemistry
Computational Theory
Computer Science Applications
Mathematics
Computational Mathematics
Three-Dimensional Imaging for Indirect-Direct Bonding
American Journal of Orthodontics and Dentofacial Orthopedics
Orthodontics
