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Publications by Stanislav Moshkalev
Correction: Formation of Pure Cu Nanocrystals Upon Post-Growth Annealing of Cu–C Material Obtained From Focused Electron Beam Induced Deposition: Comparison of Different Methods
Beilstein Journal of Nanotechnology
Electronic Engineering
Materials Science
Nanoscience
Electrical
Nanotechnology
Astronomy
Physics
Microfluidic Devices on Glass for Liquid Mixtures Concentration With Coupled THZ Sensor
Journal of Integrated Circuits and Systems
Electronic Engineering
Electrical
Related publications
Comparative Study of Cu-Precursors for 3D Focused Electron Beam Induced Deposition
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Focused Electron Beam-Induced Deposition and Post-Growth Purification Using the Heteroleptic Ru Complex (3C3H5)Ru(CO)3Br
Focused-Ion Beam Induced Deposition of Copper
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Creating Pure Nanostructures From Electron-Beam-Induced Deposition Using Purification Techniques: A Technology Perspective
Nanotechnology
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Materials Science
Nanoscience
Electrical
Bioengineering
Nanotechnology
Chemistry
Electron Induced Surface Reactions of HFeCo3(CO)12, a Bimetallic Precursor for Focused Electron Beam Induced Deposition (FEBID)
Highly Conductive and Pure Gold Nanostructures Grown by Electron Beam Induced Deposition
Scientific Reports
Multidisciplinary
Study on Strengthening Mechanism of Ti/Cu Electron Beam Welding
Materials and Design
Mechanics of Materials
Materials Science
Mechanical Engineering
Three-Dimensional Core-Shell Ferromagnetic Nanowires Fabricated by Focused Electron Beam Induced Deposition
Compound Growth Due to Isothermal Annealing of Cu-Clad Al Wire
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
