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Publications by Susumu Hioki
Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
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Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
Materials Transactions
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Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
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Magnetic Susceptibility of HCP Ζ-Phase Alloys in Ag–In, Ag–Sn, Au–In, and Au–Sn Systems
Transactions of the Japan Institute of Metals
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
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Microstructure and Corrosion Resistance of Ti–Zr–Cu–Pd–Sn Glassy and Nanocrystalline Alloys
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Solidification Behaviour of Rapidly Quenched Cu–Sn Alloys
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Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
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Autoradiography of Fe–As and Fe–Sn Dilute Alloys I. Calculation of Intensity Profile
Transactions of the Japan Institute of Metals
Activities of Oxygen in Liquid Cu–In and Cu–Sn Alloys Determined by a Modified Coulometric Titration Method
Transactions of the Japan Institute of Metals