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Publications by T. G. Golding
(Invited) Towards a Vertical and Damage Free Post-Etch InGaAs Fin Profile: Dry Etch Processing, Sidewall Damage Assessment and Mitigation Options
ECS Transactions
Engineering
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A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2and SF6/O2
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Investigation of “Fur-Like” Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
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Dry Etch Characteristics of Silylated Deep UV Resists in Novel Plasma Configurations.
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Reduction of Critical Dimension Difference in Litho-Etch-Litho- Etch Double Patterning Process
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Ex Post Damage Assessment: An Italian Experience
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Optimum Fin Profile Under Dry and Wet Surface Conditions
Extremely High Selective Etching of Porous Si for Single Etch-Stop Bond-And-Etch-Back SOI
Invited Review: Abomasal Damage in Veal Calves
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