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Publications by T. H. Chiang
Effect of Void Propagation on Bump Resistance Due to Electromigration in Flip-Chip Solder Joints Using Kelvin Structure
Applied Physics Letters
Astronomy
Physics
Structural Study of a New Amorphous La(Fe0.9Al0.1)13 Alloy Consisting of Icosahedral Clusters
Materials Transactions, JIM
Related publications
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages
Journal of Light and Visual Environment
Electronic Engineering
Electrical
Solder Paste Reflow Modeling for Flip Chip Assembly
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding
Transactions of The Japan Institute of Electronics Packaging