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Publications by T. Movius
Experimental Investigation of Mounting Thermal Resistance of Flatpacks on Circuit Boards
IEEE Transactions on Components, Hybrids and Manufacturing Technology
Electronic Engineering
Industrial
Manufacturing Engineering
Engineering
Optical
Electrical
Magnetic Materials
Electronic
Related publications
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Ecology Treatment of Printed Circuit Boards
Acta Mechanica Slovaca
Interfacial and Mechanical Property Analysis of Waste Printed Circuit Boards Subject to Thermal Shock
Journal of the Air and Waste Management Association
Management
Monitoring
Waste Management
Disposal
Atmospheric Science
Policy
Law
Pollution
High-Speed Micro Drilling on Printed Circuit Boards
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
A Study of Current Distributions on the Printed Circuit Boards
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
Electrical
A VQ-Based Approach to Thermal Image Analysis for Printed Circuit Boards Diagnosis
IEEE Transactions on Instrumentation and Measurement
Electronic Engineering
Electrical
Instrumentation
Experimental Investigation on Shear Resistance of Self-Consolidating Concrete Beams
Revista IBRACON de Estruturas e Materiais
Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards
Transactions of The Japan Institute of Electronics Packaging
On the Prevention of Electrochemical Migration in Printed Circuit Boards of Avionics
ELECTRONICS: Science, Technology, Business
