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Publications by T. N. Konkova

Microstructural Characteristics of Electrodeposited Damascene Copper Lines

Letters on Materials

Materials Science

English

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Structural Response of Nano-Scale Damascene Copper Lines to Annealing

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Chemical Mechanical Planarization of Copper Damascene Structures

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Osmium Barriers for Direct Copper Electrodeposition in Damascene Processing

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Microstructural Characteristics of Diecast AlMgSiMn Alloy

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Microstructural Characteristics of CuGaTe2polycrystalline Thin Films

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Electrodeposited Copper on Indium Tin Oxide. Reaction and Nucleation Mechanisms

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The Influence of Additives on the Mechanical Properties of Electrodeposited Copper Foils

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Microstructural Study and Recrystallization Kinetics of Deformed Commercial Copper Wires

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Relations Between Synthesis and Microstructural Properties of Copper/Zinc Hydroxycarbonates

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