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Publications by T.B. Britton
Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Related publications
Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient
Scientific Reports
Multidisciplinary
Research of Interaction Between Zn Based Solders and Cu, Al Substrates
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
The Mechanism of Aging-Suppression in Al-Cu-Sn Alloy
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
STUDIES ON THE Al-Cu-Sn ALLOY (PERT 1)
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Study on the Aging of Al-Cu-Sn Alloy (1st Report)
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Influence of Ni on the Refinement and Twinning of Primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
Intermetallics
Mechanics of Materials
Alloys
Mechanical Engineering
Metals
Materials Chemistry
Chemistry
Cu Corrosion Test Method for Lead-Free Solders
Journal of Welding and Joining
Properties of SnAgCu Solders Bearing Al Nanoparticles
